Cadence Celsius EC Solver 软件经过专门设计，使电子系统设计人员能够快速准确地解决当今最具挑战性的散热/电子冷却管理问题。 Celsius EC Solver利用强大的计算引擎和网格划分技术，使设计人员能够对复杂设计进行建模和分析，以降低产品故障的风险，并优化热解决方案以最大限度地提高性能。
x64 | File Size: 1.38 GB
Description
The Cadence Celsius EC Solver technology (formerly 6SigmaET by Future Facilities) is designed specifically to enable electronic system designers to address today’s most challenging thermal/electronics cooling management problems quickly and accurately. The Celsius EC Solver utilizes a powerful computational engine and meshing technology that enables designers to model and analyze complex designs to not only reduce the risks of product failures but also to optimize thermal solutions to maximize performance.
Electronics cooling simulation software for accurate and fast analysis of the thermal performance of electronic systems
The Celsius EC Solver analyzes the fluid flow and heat transfer of even the most complex electronic systems. The software solves for convection, conduction, and radiation using a proprietary multi-level unstructured (MLUS) meshing technology. It can analyze airflow, temperature, and heat transfer in electronic assemblies and enclosures. The solver can solve for natural convection, forced convection, solar heating, and liquid cooling.
Design Insight
Enables designers to address thermal/electronics cooling challenges in the earliest stages of a design to reduce risk of product failure and optimize performance
Intuitive UI
Saves design time and eliminates risk by automatically placing intelligent modeling objects, providing object-based mesh generation, and determining the ideal grid size for a simulation
Features
-Object-based meshing feature adapts the mesh to ensure accurate analysis of the device. Rules can be optionally defined, providing meshing guidance to ensure that the individual objects are simulated correctly.
-Imports complex mechanical computer-aided design (MCAD) models from Creo Parametric, Solidworks, CATIA, and other major MCAD tools. Imported MCAD models can be analyzed without simplification.
-Parallel processing technology distributes simulation tasks across multiple cores and multiple machines, enabling fast analysis of complex electronics designs in both transient and steady-state simulation modes.
-Automatically places intelligent modeling objects within the system-level model, providing automatic object-based mesh generation, determining the ideal grid size for a simulation, and automatically checking for collision and modeling errors before solving.
System Requirements
OS:Windows 11/Windows 10/ Windows Server 2019 / Windows Server 2016
GPU:4 GB minimum / 8 GB recommended /16 GB for the largest models (models with a large number of surfaces)
Space: 8 GB
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