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LMS Samcef Field v8.5-01

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LMS Samcef 求解器系列软件包
可用于基本的线性结构、高级柔性非线性机构及热分析的有限元求解器系列
LMS Samtech Samcef 求解器系列软件包基于有限元方法 (FEM),可涵盖机械、热和热机械等多种应用(从基本应用到高级应用),主要应用在航空、军工及汽车等行业领域。

您可将结构有限元解决方案应用于线性分析,例如线性静态计算、模态及屈曲分析、线性动力学仿真、超单元生成、随机激励和振动响应。 还可在这一系列解决方案中进行非线性瞬态仿真。 可将材料非线性、几何非线性、接触条件、大幅旋转及运动约束等因素考虑进去。 对于高速旋转机械,还有专用的模块。 热仿真可实现对包括热对流、热传导、热辐射及烧蚀在内的瞬态分析进行求解。

它具有多个级别的建模功能,包括二维平面应力或平面应变、谐波及多谐波、循环对称及全三维等模型。

由于这些模块都是软件的组成部分,您可以从一种分析切换至另一种分析(从线性仿真变为瞬态非线性仿真),将分析进行合并(热结构耦合和预应力模态分析)或进行耦合仿真。 由于具备并行计算功能,LMS Samcef 求解器系列软件包能够求解大规模有限元模型。

非线性分析

LMS Samcef 非线性分析模块可提供针对塑性、超弹性及柔性接触等非线性边界条件的解决方案。 此外,其先进的功能可支持对复杂问题的求解,例如复合材料损伤和分层破坏及柔性非线性机构,更好的对真实运动进行仿真,而不需要因为软件的限制对真实运动简化。

了解更多信息:
Samcef 非线性结构分析
Samcef 非线性运动学分析
线性分析

LMS Samcef 线性分析模块专用于结构的线性分析,包括线性静态、模态、屈曲、动力响应(模态或直接)及随机振动分析。 大型有限单元库与多种载荷及边界条件相结合,为您提供一流的建模仿真工具。

了解更多信息:
Samcef 线性结构分析
热分析

利用 LMS Samcef Thermal,您可以创建简单和复杂的热分析模型。 热分析能够考虑热传导、热对流及热辐射。 可轻松计算出结构上的温度分布,并且温度分布还可作为进一步机械分析的载荷。

了解更多信息:
Samcef Thermal
热响应

采用 LMS Samcef Amaryllis,您能够对再入大气层或火焰条件下的热烧蚀进行热响应建模,包括烧蚀热膨胀及热传导和热辐射耦合。

了解更多信息:
Samcef Amaryllis
断裂力学分析

LMS Samcef 的断裂力学分析可用于研究裂纹对结构完整性造成的影响。 LMS Samcef 可提供多种建模技术及数值方法。 最权威的方法是扩展有限元法 (XFEM),可自动计算裂纹扩展。 利用这些功能,LMS Samcef 可协助您判定裂纹是否严重。


LMS Samcef Field version 8.5-01 | 1.6 Gb

LMS, a leading provider of test and mechatronic simulation software and engineering services in the automotive, aerospace and other advanced manufacturing industries, has released the 8.5-01 version of Sancef Field – is based on the finite element method (FEM) and covers a wide range of mechanical, thermal and thermo-mechanical applications – from basic to very advanced – primarily in the aerospace, defense and automotive industries.

You can apply the mechanical FEM solver solutions to linear applications such as linear static computations, modal and buckling analyses, linear dynamic simulations, super element generation, random excitations and shock responses. Nonlinear transient simulations can also be performed within this family of solutions. Material nonlinearities, geometric nonlinearities, contact conditions, large rotations and kinematic constraints can be taken into account. A dedicated module also exists for high-speed rotating machines. Thermal simulations allow solving transient analysis including convection, conduction, radiation and ablation.

Several levels of modelization are available including 2D plane stress or plane strain, harmonic and multi-harmonic, cyclic symmetry and full 3D.

As these modules are all part of the same family, you can switch from one analysis to another (convert a linear simulation to a transient nonlinear simulation), combine analyses (thermo-mechanical, pre-stressed modal analysis) or conduct co-simulations. With parallel computing capabilities, the LMS Samcef Solver Suite also allows you to solve very large finite element models.

More info: http://www.lmsintl.com/

LMS Samcef Field version 8.5-01

About LMS

LMS is a leading provider of test and mechatronic simulation software and engineering services in the automotive, aerospace and other advanced manufacturing industries. As a business segment within Siemens PLM Software, LMS provides a unique portfolio of products and services for manufacturing companies to manage the complexities of tomorrow’s product development by incorporating model-based mechatronic simulation and advanced testing in the product development process. LMS tunes into mission-critical engineering attributes, ranging from system dynamics, structural integrity and sound quality to durability, safety and power consumption. With multi-domain and mechatronic simulation solutions, LMS addresses the complex engineering challenges associated with intelligent system design and model-based systems engineering. Thanks to its technology and more than 1250 dedicated people, LMS has become the partner of choice of more than 5000 manufacturing companies worldwide. LMS operates in more than 30 key locations around the world.

Name: LMS Sancef Field
Version: (64bit) 8.5-01
Home: www.plm.automation.siemens.com
Interface: english
OS: Windows XP / Vista / Seven / 8
Size: 1.6 Gb

Special Thanks team-SolidSQUAD


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