ANSYS有限公司全球创新者的模拟软件和技术设计来优化产品开发流程,宣布推出涡轮包分析器(TPA)8.0软件,它提供了包提取和自动化能力需要解决电气要求今天的复杂的高性能SiP,芯片规模,倒装芯片,球网格阵列和wirebond。
与TPA、IC卡和包装设计师的模拟/射频和高速数字应用程序可以完全描述整个包结构,并自动提取集中或分布RLC值与ANSYS DesignerSI使用或替代的香料兼容工具执行后续的瞬态分析,如相声、超越和热带病研究和培训特别规划。 进一步使预测的TPA IC方案性能和兼容性,促进权衡性能分析在设计致力于制造。 与领先电子包装TPA夫妇布局工具来准确的模型包互连的元素,例如非正交,wirebonds痕迹,焊球和焊盘,并考虑非理想的地面飞机普遍在这些先进的集成电路包装设计。
什么是新的在TPA 8.0:
自适应网格细分为CG和AC RL连接器；
存在解算器可执行用于直流L模拟；
信号网络分析仪:运行瞬态分析对选定的路径在设计师或HSPICE；
AnsoftLinks 3 d模型导出功能现在包括在TPA UI；
Apache CPM进口；
采用ANSYS TPA适应型的编辑与3 d SIwave ANSYS解ANSYS Q3D器。 增强自己的用户启用SIwave和Q3D器运行没有任何额外的许可证,TPA 这提供了一个自动化工程师和易于使用的解决方案RLCG提取电路的自适应网格。
ANSYS, Inc., a global innovator of simulation software and technologies designed to optimize product development processes, announced the release Turbo Package Analyzer (TPA) 8.0 software, which provides the package extraction and automation capability needed to address the electrical requirements of today’s complex high-performance SiP, chip-scale, flip-chip, ball-grid array and wirebond.
With TPA, IC and package designers of analog/RF and high-speed digital applications can fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with ANSYS DesignerSI or alternative SPICE-compatible tools to perform subsequent transient analyses, such as crosstalk, overshoot and TDR. TPA further enables the prediction of IC package performance and compatibility, facilitating performance trade-off analysis before a design is committed to fabrication. TPA couples with leading electronic package layout tools to accurately model package interconnect elements, such as nonorthogonal traces, vias, wirebonds and solder balls, and to take into account the nonideal ground planes prevalent in these advanced IC package designs.
What’s new in TPA 8.0:
– Adaptive mesh refinement for CG and AC RL solvers
– ens_solver executable used for DC L simulations
– Signal Net Analyzer: run transient analysis for a selected path in Designer or HSPICE
– AnsoftLinks 3D model export functionality is now included in the TPA UI
– Apache CPM import
ANSYS TPA employs the ECAD editor of ANSYS SIwave with the 3-D solver of ANSYS Q3D Extractor. Enhancements enable users who own SIwave and Q3D Extractor to run TPA without any additional licenses. This provides the engineer with an automated and easy-to-use solution for extraction of RLCG circuits with adaptive meshing.
About ANSYS, Inc.
ANSYS, Inc., founded in 1970, develops and globally markets engineering simulation software and technologies widely used by engineers, designers, researchers and students across a broad spectrum of industries and academia. The Company focuses on the development of open and flexible solutions that enable users to analyze designs directly on the desktop, providing a common platform for fast, efficient and cost-conscious product development, from design concept to final-stage testing and validation. The Company and its global network of channel partners provide sales, support and training for customers. Headquartered in Canonsburg, Pennsylvania, U.S.A., with more than 60 strategic sales locations throughout the world, ANSYS, Inc. and its subsidiaries employ over 1,600 people and distribute ANSYS products through a network of channel partners in over 40 countries.
Name: ANSYS Turbo Package Analyzer (TPA)
Version: 8.0
Home: www.ansys.com
Interface: english
OS: Windows XP / Vista / Seven
Size: 591.5 mb
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