Cadence公司宣布了发布Cadence® Clarity 3D Solver。这是Cadence公司系统级分析策略下推出的第一款产品，突破性的电磁场（EM）仿真技术可提供10倍的性能、无限容量，以及黄金标准的仿真精度。
这一突破性的性能是如何实现的？本文将着重讨论其在云端的应用。
尽管使用终端数据中心也可以实现相同的可扩展性，但是为了大量加载的数据中心而获取数十台服务器总是个不小的挑战。在Clarity 3D Solver之前，Cadence已宣布推出CloudBurst 平台，它支持功能验证、电路仿真、库特性和验收工具，同时也支持Clarity。
3D EM仿真
随着数据速率的提高，精准的3D EM仿真变得越来越重要。去年，Cadence宣布了112G长距离SerDes IP。该IP位于7nm芯片上，拥有一个相当良好的控制环境。但是仔细想想信号的工作流程就会发现：信号从芯片上的IP开始，通过封装到一个板上，再通过连接器进入背板，接着第二个连接器、第二块板、第二个封装，最后进入不同芯片上的接收器。当然，我们可以将所有这些简化为一个单个脉冲响应以完成信号完整性分析（详见文章 “DesignCon：Cadence与IBM联手讲授高级IBIS-AMI技术” ），但是为了使脉冲响应准确，封装、PCB走线、连接器和电缆的所有结构都需要精确建模；尤其对于拥有高度复杂机械结构的连接器而言更是如此。
汽车是另一个需要提高精确度的领域。现代汽车有很多ECU（电子控制单元），在某些情况下超过100个。其中许多都只具有相对较低的性能——调整座椅或调高娱乐系统的音量，这些都不需要兆位数据或毫秒延迟。但ADAS（高级驾驶辅助系统）确有此方面的需要：照相机、雷达和激光雷达都会产生大量数据，而自动驾驶则需要低延迟。例如，AEB（自动紧急制动）是一场刹车功能和事故发生之间的竞赛——在60英里/小时的速度下，英寸级长度和毫秒级时间的结果要进行考量。旧的汽车总线，如CANbus，缺少相应的功能特性，因此当今的汽车开始越来越多的使用以太网。数据速率将会不断提高，通过双绞线铜缆运行的千兆汽车以太网也将成为标准配置。为了实现在嘈杂的汽车环境中正常工作，我们需要对线束和连接器进行准确分析。
Clarity
对于最极端的情况，例如没有误差余地的112G长距离传输，我们需要真正的整体的3D分析。但是目前的3D建模工具并未跟上设计团队的要求——无法保证模型运算结果的精确度。EDA中的分析工具一般开始都是只能进行点分析的工具，但设计团队真正需要的是实现分析与构建的集成。随着Cadence云端的发布，计算基础设施在去年发生了改变，不再需要大型的、专用的、昂贵的服务器。
Clarity提供新一代的真正整体的3D解决方案：
黄金标准的精确性
世界级并行处理技术
高达10倍的性能提升
与Cadence工具的集成
接受CloudBurst平台支持
在分析112G连接器-PCB接口时，与40个CPU上传统场求解器的基本情况相比，使用了数百个CPU的Clarity 3D Solver的分析速度提高了12.3倍（见右图）。在汽车DDR4接口的测试案例中，则实现了10.4倍的加速。
Clarity 3D Solver与Sigrity 验收分析流程协同工作，为最具挑战的情况——如112G长距离接口，提供验收分析。对于分析工具而言，最重要的是分析结果是否与现实情况相符。下方眼图显示了使用Clarity和Sigrity（右侧浅蓝色）工具仿真结果与实际测量值（左侧粉红色）的对比，几乎毫无二致。
Teradyne 泰瑞达
泰瑞达半导体测试事业部的工程副总裁Rick Burns表示：
“对于传输速度超过千兆位以及高层数（大于30层）、高密度的PCB，我们依靠对复杂结构的精确互连模型提取来支持信号完整性分析。使用Cadence Clarity 3D Solver，我们只需花费曾经的一小部分时间即可达到所需精度。这为我们开辟了一个分析仿真的新时代，因为我们现在可以在之前运行一次模拟的时间里运行数十次模拟。这减少了重复设计，并帮助我们实现对客户的承诺——以最低的测试成本为客户提供最高的产出。”
Cadence Design Systems, Inc. entered the fast-growing system analysis and design market with the announcement of the Cadence Clarity 3D Solver, which delivers gold-standard accuracy with up to 10X faster simulation performance and unbounded capacity compared to legacy field solver technology.
Harnessing state-of-the-art distributed multiprocessing technology, the Clarity 3D Solver efficiently tackles electromagnetic (EM) challenges encountered when designing complex 3D structures on chips, packages, PCBs, connectors and cables—bringing true 3D analysis to any engineer with desktop, high-performance computing (HPC) or cloud computing resources. The Clarity 3D Solver easily reads design data from all standard chip, IC package and PCB implementation platforms while also providing unique integration benefits for design teams using the Cadence Allegro and Virtuoso implementation platforms.
Highly complex structures found in silicon interposers, rigid-flex PCBs and stacked-die IC packages must be modeled accurately in 3D for structure optimization and high-speed signaling compliance. High-speed signaling, such as in 112G serializer/deserializer (SerDes) interfaces, relies on high-fidelity interconnect design. Any slight change in impedance can negatively impact bit error rate, so optimization entails extensive research including dozens of complex extractions and simulations. To accommodate this workload, legacy field solvers must run on massive, expensive high-performance servers. In addition, speed and capacity limitations of legacy field solver technology require users to carefully simplify and/or partition the structure into smaller segments to fit within local computing constraints. This pseudo-3D approach creates the risk that the resulting final model may contain inaccuracies due to artificial effects from the superficial model boundaries.
Clarity 3D Solver technology addresses the most complex EM challenges faced when designing systems for 5G communications, automotive/ADAS, HPC and IoT applications. Industry-leading Cadence distributed multiprocessing technology enables the Clarity 3D Solver to deliver virtually unlimited capacity and a 10X speed up required to efficiently and effectively address these larger and more complex structures. The Clarity 3D Solver creates highly accurate S-parameter models for use in signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) analysis, enabling simulation results that match lab measurement.
The Clarity 3D Solver is optimized to distribute a job across multiple low-cost computers while remaining equally efficient when running on a more powerful and expensive server with terabytes of memory. A unique distributed adaptive meshing approach and significantly smaller memory requirements than legacy 3D field solvers enable the Clarity 3D Solver to extensively utilize cost-effective cloud and on-premises distributed computing. These advantages make the cloud-ready Clarity 3D Solver an ideal choice to optimize a company’s cloud computing budget.
Using the Clarity 3D Solver in conjunction with the Cadence Sigrity 3D Workbench, users can merge mechanical structures such as cables and connectors with their system design and model the electrical-mechanical interconnect as a single model. The Clarity 3D Solver is also tightly integrated with the Virtuoso, Cadence SiP Layout and Allegro implementation platforms, enabling 3D structures to be designed in the Allegro and Virtuoso environments, optimized in the analysis tool and implemented in the design tool without being redrawn.
New Products
Added In this release, the following new products have been added:
Product: Cadence Clarity
Version: 2019 version 19.00.000
Supported Architectures: x64
Website Home Page : http://www.cadence.com
Language: english
System Requirements: PC *
Supported Operating Systems: *
Size: 4.2 Gb
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