Learn about how the new cloud-ready Clarity 3D Solver lets you optimize your design for true 3D system analysis. This electromagnetic (EM) solver addresses complex 3D structures on chips, packages, and PCBs, creating highly accurate S-parameter models for use in signal integrity (SI), power integrity (PI), and electromagnetic compliance (EMC) analysis.
This new EM solver delivers up to 10X performance for electromagnetic simulation with unbounded capacity and gold-standard accuracy. To accelerate your IC package and PCB power-integrity and signal-integrity analysis as well as electromagnetic interface (EMI)/electromagnetic compatibility (EMC) analysis, the Cadence Sigrity PowerSI 3D EM Extraction Option three-dimensional (3D) full-wave and quasi-static electromagnetic (EM) field solver provides S-parameter model extraction using model reduction technology. For accuracy with complex 3D structures, the cloud-ready tool features adaptive finite element mesh (FEM) refinement technology.
The standard 2D view of the design (left) allows for selecting nets and viewing individual or groups of nets. By walking through the steps in the workflows provided, you can follow a repeatable flow for common tasks. A 3D view of the design (right) allows you to track the connectivity through vias and visualize relationships between interconnects that would not be possible with only a 2D view.
The PowerSI 3DEM option incorporates a 3D mechanical CAD GUI for creating, editing, and importing 3D solid models for 3D electromagnetic analysis. You can bring in design data from popular MCAD formats such as Acis, IGES, and STEP, as well as the Cadence Allegro and Sigrity formats. 3D mechanical components are easily created with parameterization and equation expressions to allow for modeling flexibility and simulation optimization.
Along with a host of other features, the PowerSI 3DEM option enables you to create models for use in improved time-domain transient analysis, thanks to its robust low-frequency-conditioning algorithm, which gives you stable and accurate solutions down to 100Hz. The PowerSI 3DEM option has a workflow-driven user interface and component-based automatic port generation and grouping that makes it relatively easy for you to use.
The quasi-static extractor runs much faster than the full-wave technology, but makes certain assumptions (i.e., electric and magnetic fields are independent from each other). It quickly produces interconnect model results that consist of resistance (R), inductance (L), capacitance (C), and conductance (G).
Key Benefits
-Fast, accurate EM solutions for complex 3D structures
-Workflow-driven use models
-Stackup and material properties viewing and refinement
Features
-Faster than other popular 3D FEM tools
-Fiber weave wizard to consider inhomogeneous substrate
-Frequency-dependent materials support
-Surface roughness metal thickness
-Parametric sweep for design for manufacture (DFM)
-Easily create, edit, and import 3D mechanical models
-Stackup and material properties viewing and refinement
-Optimized for flows with Cadence SiP Layout, Allegro Package Designer, and Allegro PCB Designer, including direct launch from Cadence Allegro Sigrity SI/PI base
-Readily used with Cadence, Mentor or Zuken package databases
System Requirements:
OS:Microsoft Windows 7 all versions (64-bit), Windows 10 (64-bit), Windows 2012 Server (All service packs), Windows 2016 Server (All service packs)
CPU:Intel IA-64 Compatible (includes P4 EMT and AMD Opteron™)
RAM:8 GB RAM Virtual memory at least twice physical memory
Space:50 GB free disk space
Display:1,024 x 768 display resolution with true color (16bit color)
Recommended:
CPU:Intel Core i7 4.30 GHz or AMD Ryzen 7 4.30 GHz with at least 4 cores
RAM:64 GB RAM or higher; 192 GB of RAM or higher is recommended for 3D–EM
Website Home Page : http://www.cadence.com
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